Skip to content
FLFunding Landscape
OpenDue June 30, 2026·Synced from source June 28, 2026

Multichip Module Package for SiC Pressure Sensors

Ohio

Apply at Ohio

About this opportunity

Solicitation title: Multichip Module Package for SiC Pressure Sensors. Location: Ohio. Published: 2026-06-26. Closing date: 2026-06-30. BidNet Direct lists open solicitations from public agencies. Visit the detail page for scope, required documents, and submission instructions.

Finding similar opportunities...