SBIR DPA26BZ02-NV008 (DARPA): TEMPERATURE-HARDENED ELECTRONICS FOR RELIABLE MISSION-CRITICAL APPLICATIONS (THERMAL)
U.S. Department of Defense — DARPA
Who can apply
Small Business. Startup
About this opportunity
DARPA SBIR topic — under DoW SBIR 2026 BAA (Solicitation 26.BZ, Release 2) — Accepting submissions 2026-05-27 to 2026-06-24. Objective: To develop a manufacturable mixed-signal integrated circuit (IC) technology capable of reliable operation in harsh environments, specifically high-temperature conditions up to 800°C. Description: The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the research and development of mixed-signal IC technology. Semiconductor electronics face significant challenges in extreme thermal environments, where conventional silicon-based technologies degrade beyond 250°C, limiting their use in defense, aerospace, and energy applications. As demand grows for long-duration reliability, wide-bandgap materials like silicon carbide (S...