Silicon Carbide (SiC) Packaging Prize
American-Made Program (via HeroX)
About this archived opportunity
Overview The three-phase $2.25 million Silicon Carbide (SiC) Packaging Prize—launched by the U.S. Department of Energy’s (DOE’s) Office of Electricity—invites competitors to propose, design, build, and test state-of-the-art SiC packaging prototypes that move the industry beyond its current state.Silicon carbide has become transformational to the power industry in countless applications across the industrial, energy, and automotive segments. SiC devices are prime candidates for future high-performance power electronics due to their high breakdown voltage, low switching loss, and high-temperature operation. However, conventional packaging techniques limit the performance of SiC power modules due to parasitic inductance and heat dissipation issues. To enable grid-based applications, SiC power modules need to be expanded to higher voltage and higher current ratings.Could your team’s innovative prototype be the winning solution? Find more information about submission requirements, judging criteria, and other important prize details in the Official Rules document.Phases and PrizesPhase 1 – Design StudyCompetitors will describe their team, their plan to make progress toward SiC packaging, showcase their current prototypes, and provide evidence of their current metrics that are in alignment with the goals of the prize. The goal of this phase is to develop a set of design documents for a Phase 2 prototype which adheres to the requirements set.Prizes: Up to 10 winners of $50,000 eachPhase 2 – Initial DemonstrationIn Phase 2, winners from Phase 1 will showcase and demonstrate the advancements made during the prize competition in packaging solutions for SiC modules, meeting, exceeding, or making progress toward the Phase 2 performance metrics as outlined in the rules. This phase is designed to act as a milestone towards achieving the Phase 3 target with the goal of innovating towards an improvement over state-of-the-art packaging and creating transformative solutions. Prizes: U
Historical details
- Status
- Closed
- Deadline
- April 29, 2027
- First captured
- January 9, 2026
- Award
- $2,200,000
- Publisher reference
- https://www.herox.com/SiCPackagingPrize
This opportunity has closed
Silicon Carbide (SiC) Packaging Prize
by American-Made Program (via HeroX)
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