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OpenDue April 28, 2026·$2,200,000

Silicon Carbide (SiC) Packaging Prize

American-Made Program (via HeroX)

About this opportunity

Overview Guidelines Overview The three-phase $2.25 million Silicon Carbide (SiC) Packaging Prize—launched by the U.S. Department of Energy’s (DOE’s) Office of Electricity—invites competitors to propose, design, build, and test state-of-the-art SiC packaging prototypes that move the industry beyond its current state.Silicon carbide has become transformational to the power industry in countless applications across the industrial, energy, and automotive segments. SiC devices are prime candidates for future high-performance power electronics due to their high breakdown voltage, low switching loss, and high-temperature operation. However, conventional packaging techniques limit the performance of SiC power modules due to parasitic inductance and heat dissipation issues. To enable grid-based app...

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