SBIR OSW26BZ05-NV021 (Office of the Secretary of Defense): Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging
U.S. Department of Defense — Office of the Secretary of Defense
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- Posted
- Aug 6, 2026
- Closes
- Sep 23, 2026 (in 27 days)
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Amount
Amount not published by the funder
Who can apply
Small Business. Startup
About this opportunity
Office of the Secretary of Defense SBIR topic — under DoW SBIR 2026 BAA (Solicitation 26.BZ, Release 5) — Accepting submissions 2026-08-26 to 2026-09-23. Objective: Model, design, and produce a readout integrated circuit with a photonic digital output for an infrared sensor demonstration in a cryogenic environment. Description: State of the art infrared digital focal plane arrays (FPAs) can produce >20 Gbps when operated at standard video framerates and in large formats. Designing output drivers for this bitstream in a cryogenic environment is nontrivial. It requires careful balancing of the electrical, mechanical, and thermal constraints of the readout integrated circuit (ROIC). Industry surveys indicate that the current state of practice is limited to just under 3 Gbps per channel and 10...