About this archived opportunity

Amendment 0001 to RFP W519TC-25-R-0034 is hereby issued to extend the proposal submission date to February 17, 2026 and to update clauses/provisions. Please use the following link to access Amendment 0001: https://piee.eb.mil/sol/xhtml/unauth/search/oppMgmtLink.xhtml?noticeId=W519TC25R0034¬iceType=SolicitationNotice ****************************************************************************** Updated version of the Comment/Question and Answer Template has been uploaded. Previous version was not accessible for input. ****************************************************************************** A Comment/Question and Answer Template has been added to the Attachments section. Please use this template to submit comments/questions for the subject acquisition via email to Mark Stevens (mark.d.stevens.civ@army.mil) and Alex Sheppard (alex.r.sheppard.civ@army.mil) or via the PIEE website (access through the PIEE website link below). Submissions are due by 1500 Central Standard Time on Friday, December 12, 2025. ******************************************************************************** The Technical Data Packages for this procurement are now uploaded to the Attachments section. ******************************************************************************** Please use the following link to access the RFP/Solicitation document and Attachments for the subject procurement: https://piee.eb.mil/sol/xhtml/unauth/search/oppMgmtLink.xhtml?noticeId=W519TC25R0034¬iceType=SolicitationNotice NOTE: The Government is utilizing the Procurement Integrated Enterprise Environment (PIEE) website to release the RFP/Solicitation and to receive proposals for the subject procurement. The PIEE website communicates with SAM.gov, however, there is a technical issue that is preventing the PIEE announcement of the subject RFP/Solicitation release from reaching SAM.gov. There is a chance there will be a duplication of this announcement in SAM.gov in the future; however, the PIEE link above will remain valid. The Technical Data Packages associated with this procurment will be uploaded to this SAM.gov announcement shortly.