About this archived opportunity

This Call for Solution is issued under the Army Open Solicitation W9128Z-25-S-A002. The Army Contracting Command � Redstone Arsenal, on behalf of the office of the US Army Aviation and Missile Command (AMCOM), is seeking innovative solutions for Advanced Manufacturing Components and OIB Technology Insertion. The U.S. Army has a need for accelerated modernization of weapon systems through Advanced Manufacturing (AdvM) technologies that directly address supply chain challenges to underpin readiness. In Accordance With (IAW) Army Regulation (AR) 750-1 (Army Materiel Maintenance Policy), Commanders, U.S. Army Organic Industrial Base (OIB) activities will develop additive and advanced capabilities consistent with Army Materiel Command (AMC) guidance to produce Original Equipment Manufacturer (OEM) quality parts for use to meet obsolescence and other readiness requirements as required. The U.S. Army Aviation and Missile Command (AMCOM) require immediate integration of AdvM FDM capability at Corpus Christi Army Depot (CCAD) with an option for AdvM FDM capability at Letterkenny Army Depot (LEAD) to address critical readiness gaps in aviation maintenance operations. The integration of AdvM FDM print technology will enable CCAD to rapidly fabricate qualified parts, tools, jigs, fixtures, and ground support equipment. The Call for Solutions document outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below. The deadline to submit questions for Phase 1 is June 24th, 2026 at 12:00 PM Central Daylight Time (CDT). The following shall be utilized in the email subject line: "Call for Solution � AdvM Fused Deposition Modeling Printer Capability / W9128Z-25-S-A002 (Question regarding section #)" The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/09ab570a35484c6cb5c6eba05cad19b3/view Please review the AOS posting and associated attachments, in addition to the attachment to this call, for further information on how the AOS is structured.

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