Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
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- Posted
- Aug 12, 2026
- Closes
- No deadline published by the funder
At a glance
This is a government contract opportunity posted by NATIONAL AERONAUTICS AND SPACE ADMINISTRATION in the professional organizations category.
Classification and identifiers
- Industry (NAICS)
- Professional Organizations (813920)
- Product or service (PSC)
- Miscellaneous Fiber Optic Components (6099)
- Solicitation number
- 80NSSC26939631Q
- Contracting office
- NASA SHARED SERVICES CENTER
Who can apply
About this opportunity
NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 – 1301 United States is the sole provider of Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC). The Government intends ...