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Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

DEPT OF DEFENSE

Special Notice · not a solicitation. There is nothing to bid on yet: agencies use this notice type for market research or information. You can respond to get on their radar, but do not budget proposal time for it.

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Posted: Aug 19, 2026
Closes: No deadline published by the funder

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At a glance

This is a government contract opportunity posted by DEPT OF DEFENSE in the research and development in the physical category.

Classification and identifiers

Industry (NAICS): Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) (541715)
Product or service (PSC): Engineering and Technical Services (R425)
Solicitation number: W52P1J26R0001
Contracting office: DEPT OF THE ARMY

Who can apply

Location not specified

About this opportunity

Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas: 1. Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with commercial-off-the-shelf (COTS) devices across modular open systems architectures (MOSA) form factor systems (e.g...